CHO-BOND® 1029
TWO COMPONENT FLEXIBLE ELECTRICALLY CONDUCTIVE SILICONE ADHESIVE
Customer Value Proposition:
CHO-BOND 1029 is a silver plated copper filled, two-component conductive silicone designed for applications where a flexible, strong, conductive electrical bond must be achieved. CHO-BOND
1029 greatly simplifies the problem of bonding conductive silicone EMI gaskets to metal substrates. It is formulated for relatively small bond lines (less than 0.010 inches (0.25mm)), and should not be used as an EMI caulk where bond lines are greater than 0.10 inches (0.25 mm).
Low volatile organic compounds (VOCs) and minimal shrinkage upon curing make CHO-BOND
1029 a good choice for a variety of commercial and military applications. Curing of CHO-BOND
1029 can be achieved in as little as 30 minutes with heat to minimize equipment downtime and
increase manufacturing throughput. CHO-BOND
1029 is supplied as a two component system, one part liquid and one part wet powder solid. For optimum mixing and material performance, the sand-like solid part should be added incrementally to the liquid part and mixed slowly over a 10
minute time period.
For best adhesion results, CHO-BOND 1029
should be used in conjunction with CHO-SHIELD
1085 primer. Typical applications include bonding, repair, and attachment of EMI gaskets, and sealing
Features and Benefits:
&S226; Two component &S226; Fast heat cure, increases throughput,
minimizes equipment downtime.
around EMI vents and windows.
&S226; Silver plated copper
filler
&S226; Good conductivity 0.060 ohm-cm.
Contact Information: Parker Hannifin Corporation Chomerics Division
77 Dragon Court
Woburn, MA 01801
phone 781 935 4850
&S226; Low VOCs &S226; Minimal shrinkage.
&S226; Heat cure silicone &S226; Flexible, 120 minute working life,
> 450 psi lap shear strength, 24 hr handling time at room temperature , wide range of application temperatures. 1 week for full cure.
fax 781 933 4318
chomailbox@parker.com
&S226; Non corrosive cure
mechanism
&S226; No corrosive by-products generated during
curing to damage substrate.
www.chomerics.com
www.parker.com/chomerics
&S226; Thick paste &S226; Can be used on overhead or vertical surfaces.
CHO-BOND 1029 - Product Information
Table 1 Typical Properties
|
CHO-BOND 1029 |
|
Typical Properties |
Typical Values |
Test Method |
|
Polymer |
Silicone |
N/A |
|
Filler |
Silver-Plated Copper |
N/A |
|
Mix Ratio, A : B (by weight) |
1.0 : 2.5 |
N/A |
|
Color |
Brownish Red |
N/A (Q) |
|
Consistency |
Thick Paste |
N/A (Q) |
|
Maximum DC Volume Resistivity |
0.060 ohm-cm |
CHO-95-40-5555* (Q/C) |
|
Minimum Lap Shear Strength** |
450 psi (3103 kPa) |
CHO-95-40-5300* (Q/C) |
|
Minimum Peel Strength** |
6.0 lb./inch (1051 N/m) |
CHO-95-40-5302* (Q/C) |
|
Specific Gravity |
3.1 |
ASTM D792 (Q/C) |
|
Hardness |
80 Shore A |
ASTM-D2240 (Q/C) |
|
Continuous Use Temperature |
- 55°C to 125°C (-67 °F to 257 °F) |
N/A (Q) |
|
Elevated Temperature Cure Cycle |
0.5 hour @ 121 oC (250 oF) |
N/A |
|
Room Temperature Cure |
1 week*** |
N/A (Q) |
|
Working Life |
2.0 hours |
N/A (Q) |
|
Shelf Life, unopened |
6 months @ 25°C (77°F) |
N/A (Q) |
|
Minimum thickness recommended |
N/A |
N/A |
|
Maximum thickness recommended |
0.008 in (0.20 mm) |
N/A |
|
Volatile Organic Content (VOC) |
14 g/l |
Calculated |
|
Theoretical Coverage Area at 0.010” Thick per Pound (454 grams) |
900 in2 (5806 cm2) |
N/A |
|
Theoretical Coverage - Length of an 1/8” Diameter Bead per
Pound (454 grams) |
60 feet (18.3 m) |
N/A |
Note: N/A – Not Applicable, (Q/C) - Qualification and Conformance Test, (Q) - Qualification Test
* This test Method is available from Parker Chomerics.
** Minimum values listed are based on using the CHO-SHIELD 1085 primer that typically comes bundled with the CHO-BOND.
*** Cure is sufficient for handling in 24 hours. Full specification properties are developed after 1 week (168 hours) at room temperature.
Ordering Procedure
CH0-B0ND 1029 is available in 3 oz. (85 g) and 1 lb. (454 g) kits. Each kit includes resin, hardener, primer and instructions.
Table 2 Ordering Information
|
Product |
Weight (grams) |
Packaging |
Part Number |
Primer Included |
|
CHO-BOND 1029 |
85 |
Part A in an 4 oz. and Part B in a 4 oz. polypropylene kit |
50-00-1029-0000 |
1085 |
|
454 |
Part A in an 8 oz. and Part B in a 6 oz. polypropylene kit |
50-01-1029-0000 |
1085 |
Please refer to Parker Chomerics Surface Preparation and CHO-BOND Application documents for information regarding
the proper surface preparation, primer application (if required), and use of these compounds.
www.chomerics.com
www.parker.com/chomerics
CHOMERICS and CHO-BOND is a registered trademark of Parker Hannifin Corporation. ® 2013 TB 1137 EN January 2014
